Description: Advancements in AI and IoT for Chip Manufacturing and Defect Prevention by Rupal Jain Estimated delivery 3-12 business days Format Paperback Condition Brand New Description This is essential reading for semiconductor professionals seeking to expand their knowledge on silicon processes, understand defect prevention, and explore optimizing processes by reducing defects using AI and IoT technologies. It charts a course where semiconductor manufacturing defects are minimized and maximizes productivity. Publisher Description This is essential reading for semiconductor professionals seeking to expand their knowledge on silicon processes, understand the significance of defect prevention, and explore methods for optimizing processes by reducing defects using AI and IoT technologies.In the dynamic landscape of semiconductor manufacturing, the focus on processes and defect prevention stands paramount. Traditional approaches have yielded valuable insights, yet the emergence of Artificial Intelligence (AI) and Internet of Things (IoT) technologies heralds a new era in defect prevention strategies. Engineers specializing in AI and machine learning, interdisciplinary researchers, and early graduates aspiring to enter the semiconductor industry will also find this book invaluable.Meticulously crafted, this book provides concise, yet insightful content tailored to todays fast-paced readers. It emphasizes semiconductors, manufacturing processes, and defect prevention, offering a comprehensive understanding of these critical areas. The integration of AI and IoT in chip manufacturing defect prevention represents a groundbreaking advancement.Targeting semiconductor engineers, researchers, technology professionals, and students, this book serves as a valuable resource for understanding the interplay between semiconductors, manufacturing processes, defects, and the transformative potential of AI and IoT integration. Practical tools for failure analysis and parameter control are provided, along with hypothetical use cases and theoretical applications that inspire innovation. Through interdisciplinary insights, this book charts a course toward a future where semiconductor manufacturing defects are minimized, productivity is maximized, and innovation thrives at the intersection of technology and industry. Author Biography Rupal Jain is a distinguished figure in the field of semiconductor chip manufacturing, with extensive expertise in engineering, program management, and strategic alignment. Throughout her career, she has spearheaded projects encompassing the entire chip development lifecycle – from design conception and quality management to global delivery across regions like the USA, Taiwan, Singapore, Italy, Malaysia, China, and India. Her profound knowledge is recognized by prestigious certifications like PMP, CSM, and Lean Six Sigma Black Belt. Rupal holds a masters degree in electrical and Electronics Engineering, earned through a joint program between NTU Singapore and TUM Germany. Beyond her technical prowess, Rupals innovative contributions have garnered international acclaim. She is a frequent contributor to esteemed publications, serves on prestigious juries, and holds nominated memberships in industry organizations. Notably, her work has been recognized with coveted awards and patents, further solidifying her position as a leader in the field. Her other authored pieces- ""Mastering Project Management: PMP and Agile for Leaders"" and ""Semiconductor Essentials : A Leaders Express reference to Electronics Concepts"" promise to share her valuable insights with the next generation of leaders and engineers. Details ISBN 8770046816 ISBN-13 9788770046817 Title Advancements in AI and IoT for Chip Manufacturing and Defect Prevention Author Rupal Jain Format Paperback Year 2024 Pages 138 Publisher River Publishers GE_Item_ID:168444820; About Us Grand Eagle Retail is the ideal place for all your shopping needs! With fast shipping, low prices, friendly service and over 1,000,000 in stock items - you're bound to find what you want, at a price you'll love! Shipping & Delivery Times Shipping is FREE to any address in USA. Please view eBay estimated delivery times at the top of the listing. Deliveries are made by either USPS or Courier. We are unable to deliver faster than stated. International deliveries will take 1-6 weeks. 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Price: 113.19 USD
Location: Fairfield, Ohio
End Time: 2025-02-05T03:10:56.000Z
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Format: Paperback
ISBN-13: 9788770046817
Author: Rupal Jain
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Book Title: Advancements in AI and IoT for Chip Manufacturing and Defect Prev
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